Projects
Projects are defined by the calendar year. Multi-year research is divided into a series of one-year projects subject to IAB renewal.
Total Direct Research
Pre-publication Reports
Total Projects
2024 Projects
2023 Projects
2022 Projects
Computing
C1 – Spatio-Temporal Neural Filtering and Processing for Smart Camera Platform
Avik Ghosh (UVA) and Mircea Stan (UVA)
Develops a unified platform for smart camera signal processing architecture consisting of Reservoir Computing based neuro-adaptive filters coupled with a hybrid Convolutional Neural Networks and Hierarchical Temporal Memory (CNN-HTM) based learning and inferencing network that can learn, predict and detect user defined features from the camera’s noisy imaging data in real time.
C2 – Hybrid Topological Insulator-ferromagnet Stackers for In-memory Computing
Avik Ghosh (UVA)
Explores the interaction between a ferromagnet (FM) and a topological insulator (TI) as a means to design an in-memory computing element. This element will (a) use TIs to write information onto a magnetic tunnel junction read unit, and (b) use a separate magnet to open and close a TI gap. The former will be used at a single bit cell level for efficient switching, while the latter will be used at the architecture level for row-column selection, much like a 1T-1C DRAM.
C3 – Interoperable Emerging Memory Technology (EMT)
emulation platform
Mircea Stan (UVA) and Kevin Skadron (UVA)
The main goal of this project is to continue adding memory model support to the Emerging-Memory
Technology (EMT) emulation platform developed at the University of Virginia. Additionally, a secondary
goal is to continue porting UVA’s existing platform from Xilinx to an Intel/Altera platform. Finally, a third goal is to create an API for using the EMT emulation platform with architecture level simulators such as GEM5 and/or SST.
Integration
I1 – Spectroscopy Investigations of Sn Resonant Doping in Bi2Se3
Stephen McDonnell (UVA)
Demonstrates control of the Fermi level position in
topological insulators (TI’s) such as Bi2Se3 using Sn as a resonant dopant to enable ultra-low power electronics. It also has the additional potential to boost this material’s thermoelectric performance.
I2 – Flexible Smart-Substrate Hybrid Electronics
Hugh Fan (UF) and Toshi Nishida (UF)
Development of the large area strain and temperature sensors on the flexible substrate through additive manufacturing approaches provides technologies for enabling high volume manufacturing. This method would also improve the packaging of sensors and increasing the variety of sensors that can be assembled on a single platform.
Sensing
S1 – Flat-Packaged Optical Pressure Sensor for Extreme Temperature Environments
Mark Sheplak (UF)
Develops time-resolved dynamic pressure sensing technology for high-temperature (>1000 °C) applications in the aerospace, energy, and automotive sectors. A flat-packaged design will extend the applicability of this sensor to thin-wall locations
S2 – 3D Microelectrode Arrays (3D MEAs) for Zebrafish Cardiac Measurements
Swaminathan Rajaraman (UCF)
Develops a polymer-3D microneedle-based micromachining technology for a 3D Microelectrode Array (3D MEA) to interface directly with zebrafish heart for cardiac measurements in vivo at the sponsor.
Wireless
2021 Projects
Computing
C1 – Spatio-Temporal Neural Filtering and Processing for Smart Camera Platform
Avik Ghosh (UVA) and Mircea Stan (UVA)
Develops a unified platform for smart camera signal processing architecture consisting of Reservoir Computing based neuro-adaptive filters coupled with a hybrid Convolutional Neural Networks and Hierarchical Temporal Memory (CNN-HTM) based learning and inferencing network that can learn, predict and detect user defined features from the camera’s noisy imaging data in real time.
C2 – Hybrid Topological Insulator-ferromagnet Stackers for In-memory Computing
Avik Ghosh (UVA)
Explores the interaction between a ferromagnet (FM) and a topological insulator (TI) as a means to design an in-memory computing element. This element will (a) use TIs to write information onto a magnetic tunnel junction read unit, and (b) use a separate magnet to open and close a TI gap. The former will be used at a single bit cell level for efficient switching, while the latter will be used at the architecture level for row-column selection, much like a 1T-1C DRAM.
C3 – Room Temperature Ultra-fast IR Detectors Using Patterned Graphene Absorbers on MCT
Avik Ghosh (UVA) and Debashis Chanda (UCF)
Uses patterned graphene contacts with spatio-temporal modulation to create ultrafast room temperature long wavelength infrared (LWIR) detectors. Present day MCT and Type-II SLS detectors need bulky cooling and uncooled
bolometers are slow. Electrons in graphene can be ultra-fast due to high mobility electrons but have very low (2%) absorption. The idea is to enhance absorption across graphene that is then coupled to thin MCT for faster IR detection that can be achieved at higher operating temperature (HOT).
C4 – Memory Emulation Platform
Mircea Stan (UVA)
Adds memory model support (such as HBM and Optane/3D XPoint) for the Emerging-Memory Technology (EMT) emulation platform developed at the University of Virginia. Additionally, a secondary goal is to port UVA’s existing platform from Xilinx to an Intel/Altera platform (e.g., Arria 10 or Stratix 10). This will enable greater collaboration with government design groups.
Integration
I1 – Spectroscopy Investigations of Sn Resonant Doping in Bi2Se3
Stephen McDonnell (UVA)
Demonstrates control of the Fermi level position in
topological insulators (TI’s) such as Bi2Se3 using Sn as a resonant dopant to enable ultra-low power electronics. It also has the additional potential to boost this material’s thermoelectric performance.
I2 – Broadening Materials and Processes for Smart-Substrate Hybrid Electronics
Hugh Fan (UF) and Toshi Nishida (UF)
Development of the large area strain and temperature sensors on the flexible substrate through additive
manufacturing approaches provides technologies for enabling high volume manufacturing. This method
would also improve the packaging of sensors and increasing the variety of sensors that can be assembled
on a single platform.
I3 – Large Area and High Resolution Multi-material uSL for Multifunctional Devices
Toshi Nishida (UF)
Develops a high resolution, large area multiple material process to fabricate heterogenous mesoscale 3D devices with micrometer scale resolutions using UV projection
microstereolithography (uSL), an additive manufacturing process (3D printing). The fabricated devices are comprised of multiple materials which are UV polymerized within the same process.
Sensing
S1 – Flat-Packaged Optical Pressure Sensor for Extreme Temperature Environments
Mark Sheplak (UF)
Develops time-resolved dynamic pressure sensing technology for high-temperature (>1000 °C) applications in the aerospace, energy, and automotive sectors. A flat-packaged design will extend the applicability of this sensor to thin-wall locations
S2 – Controlling Infrared Modulation with Thermal Resistances
Patrick Hopkins (UVA)
Demonstrates that thermal and electronic excitations can be used to independently control the infrared (IR) optical properties of mid-wave and far-wave IR materials, with a particular emphasis in temporally controlling the optical response of these materials via either modulated thermal stimuli or nonequilibrium excitations that can lead to optical limiting responses.
Wireless
W1 – Ultra-compact Magnetoelectric Nanowire Antennas
David Arnold (UF), Jenny Andrew (UF), YK Yoon (UF)
Develops ultra-compact antennas, where the antenna size is much smaller than the electromagnetic wavelength.
2020 Projects
Computing
C1 – Spatio-Temporal Neural Filtering and Processing for Smart Camera Platform
Avik Ghosh (UVA) and Mircea Stan (UVA)
Develops a unified platform for smart camera signal processing architecture consisting of Reservoir Computing based neuro-adaptive filters coupled with a hybrid Convolutional Neural Networks and Hierarchical Temporal Memory (CNN-HTM) based learning and inferencing network that can learn, predict and detect user defined features from the camera’s noisy imaging data in real time.
C2 – Brain-Inspired Reconfigurable Smart Image Sensors
Christophe Bobda (UF)
Develops a smart sensor that integrates computation and sensing in single device.
Integration
I1 – Reliability of Through-Glass Vias (TGVs)
Tengfei Jiang (UCF)
Investigates the reliability of Cu-filled through-glass vias
(TGVs) by a combined experimental and modeling approach.
I2 – Development of multi-material uSL process
Toshi Nishida (UF)
Develops a multiple material process to fabricate heterogenous micrometer-scale 3D devices using UV projection microstereolithography (uSL), an additive manufacturing process (3D printing).
I3 – Towards Development of a Digital Twin of Component Attachment for Flexible Hybrid Electronics
Hugh Fan (UF) and Toshi Nishida (UF)
Increases the physical understanding and provides predictive modeling of the reliability of component attachment on flexible substrates.
Sensing
S1 – Flat-Packaged Fiber Optic Lever Dynamic Pressure Sensor Technology for Extreme Temperature Environments
Mark Sheplak (UF)
Develops time-resolved dynamic pressure sensing technology for high-temperature (>1000 °C) applications in the aerospace, energy, and automotive sectors.
S2 – Dual-axis Wall Shear Stress Sensor System
Mark Sheplak (UF)
Develops a MEMS-based sensor with a protective coating to measure time-resolved wall shear stress within aerodynamic flows.
S3 – Characterization of an Optical MEMS Multi-hole Probe
Mark Sheplak (UF)
Develop a miniature, fast-response, multi-hole probe using fiber-optic, lever-based MEMS pressure sensors.
S4 – High Bandwidth Heat Flux Sensor
Mark Sheplak (UF)
Develops a MEMS-based sensor capable of obtaining time-resolved, high frequency heat flux measurements in hypersonic flows.
S5 – MWIR/LWIR Imaging Fiber Bundle Development
Kyle Renshaw (UCF)
Develops coherent fiber bundles for MWIR/LWIR image relays, and supports new
optical designs for compact, wide-angle imaging that utilize curved image surfaces.
S6 – High-dynamic range micro-LIDAR
Sanjeev Koppal (UF) and Huikai Xie (UF)
Increases the dynamic range (i.e., HDR) of a miniature, lowpower LIDAR system without compromising the range of the sensor.
S7 – Development of 3D Microelectrode Arrays
Swaminathan Rajaraman (UCF)
Develops a glass/3D metal-based micromachining technology for a 3D Microelectrode Array to interface directly with the “Nerve on a Chip”
S8 – Integrated sensors for environmental monitoring
Y.K. Yoon (UF)
Develops an integrated wireless Nitrogen, Phosphorus, Potassium, and pH sensing system.
S9 – Controlling infrared modulation with thermal resistances
Patrick Hopkins (UVA)
Demonstrates that thermal
and electrical excitations can be used to independently control the infrared (IR) optical properties of vanadium dioxide (VO2).
Wireless
W1 – Si-Integrated Doherty-Like Load-Modulated Balanced Amplifier for 5G and Beyond
Kenle Chen (UCF)
Develops a new class of radio-frequency (RF) power amplifier (PA) in Si-integrated form based on our newly established active-load-modulation architecture for high-efficiency and highfidelity transmission of 5G signals.
Publications
Journals
| Title | Journal | Author(s) | Date | Link |
|---|---|---|---|---|
| The effect of materials and design on the reliability of through-glass vias for 2.5 D integrated circuits: a numerical study | Multidiscipline Modeling in Materials and Structures | Omar Ahmed, Chukwudi Okoro, Scott Pollard, and Tengfei Jiang | September 2020 | Link |
| The interfacial reliability of through-glass vias for 2.5D integrated circuits | Microelectronics International | Omar Ahmed, Chukwudi Okoro, Scott Pollard, and Tengfei Jiang | August 2020 | Link |
| A MEMS-Based Fast-Response Miniature Five-Hole Probe With Optical Pressure Transducers | Microelectromechanical Systems | Haocheng Zhou and Mark Sheplak | July 2020 | Link |
| A Flush-Mounted Dual-Axis Wall Shear Stress Sensor | Microelectromechanical Systems | Brett R. Freidkes, David A. Mills, William C. Patterson, Philip M. Fournier, and Mark Sheplak | July 2020 | Link |
| Ultra Low Power Current Sensor Utilizing Magnetoelectric Nanowires | IEEE Sensors Journal, Volume: 20, Issue: 10 | Matthew Bauer, Andrew Thomas, Bridget Isenberg, John Varela, Andrea Faria, David Arnold, and Jennifer Andrew | May 2020 | Link |
| A Carbon Nanotube–Metal Oxide Hybrid Material for Visible-Blind Flexible UV-Sensor | Micromachines 2020, 11(4), 368 | Pawan Pathak, Sanghoon Park and Hyoung Jin Cho | April 2020 | Link |
| Characterization of Bending, Crease, Aging and Immersion Effects on Flexible Screen-printed Silver Traces | IEEE Transactions on Components, Packaging and Manufacturing Technology, Volume: 10, Issue: 3 | Kartik Sondhi, Sai Guruva Reddy Avuthu, Jörg Richstein, Z. Hugh Fan, and Toshikazu Nishida | March 2020 | Link |
| Micro-Compression of Freestanding Electroplated Copper Through-Glass Vias | IEEE Transactions on Device and Materials Reliability, Volume: 20, Issue: 1 | Omar Ahmed, Golareh Jalilvand, Chukwudi Okoro, Scott Pollard, Tengfei Jiang | March 2020 | Link |
| Experimental Investigation of Buffer Traps Physical Mechanisms on the Gate Charge of GaN-on-Si Devices under Various Substrate Biases | Applied Physics Letters, 116, 083501 | Wen Yanga and Jiann-Shiun Yuan | February 2020 | Link |
| Near Ultraviolet Enhanced 4H-SiC Schottky Diode | Applied Physics Letters, 115, 261101 | Yang Shen, Andrew H. Jones, Yuan Yuan, Jiyuan Zheng, Yiwei Peng, Brenda VanMil, Kimberley Olver, Anand V. Sampath, Cory Parker, Elizabeth Opila, and Joe C. Campbell | December 2019 | Link |
| Thermal Conductivity and Phonon Scattering Processes of ALD Grown PbTe/PbSe Superlattice Thin Films | Advanced Functional Materials, Volume 29, Issue 46 | Mallory E. DeCoster, Xin Chen, Kai Zhang, Christina M. Rost, Eric R. Hoglund, James M. Howe, Thomas E. Beechem, Helmut Baumgart, and Patrick E. Hopkins | September 2019 | Link |
| Flexible screen-printed coils for wireless power transfer using low-frequency magnetic fields | Journal of Micromechanics and Microengineering, Volume 29, Number 8 | K Sondhi, N Garraud, D Alabi, D P Arnold, A Garraud, S G R Avuthu, Z H Fan and T Nishida | June 2019 | Link |
| Magnetic field sensors using arrays of electrospun magnetoelectric Janus nanowires | Microsystems & Nanoengineeringvolume 4, Article number: 37 (2018) | Matthew J. Bauer, Xiao Wen, Prabal Tiwari, David P. Arnold & Jennifer S. Andrew | December 2018 | Link |
| Experimental demonstration of multi-watt wireless power transmission to ferrite-core receivers at 6.78 MHz | Wireless Power Transfer, Volume 6, Issue 1 March 2019 , pp. 17-25 | Stasiu Chyczewski, Seahee Hwangbo, Yong-Kyu Yoon and David P. Arnold | December 2018 | Link |
| Airbrushing and surface modification for fabricating flexible electronics on polydimethylsiloxane | Journal of Micromechanics and Microengineering, Volume 28, Number 12 | Kartik Sondhi, Seahee Hwangbo, Yong-Kyu Yoon, Toshikazu Nishida and Z Hugh Fan | November 2018 | Link |
| Doped Hf0.5Zr0.5O2 for High Efficiency Integrated Supercapacitors | Applied Physics Letters, 110, 232904 | Patrick D. Lomenzo, Ching-Chang Chung, Chuanzhen Zhou, Jacob L. Jones, and Toshikazu Nishida | May 2017 | Link |
| Zno Nanoflakes as a Template For In-Situ Electrodeposition of Nanostructured Cobalt Electrodes as Amperometric Phosphate Sensors | Materials Letters, 192, 107–110 | Xiaochen Wang, Xiangmeng Ma, Jared Church, Sunkook Jung, Younggyu Son, Woo Hyoung Lee, and Hyoung J. Cho | April 2017 | Link |
| Mutual Coupling Reduction using Micromachined Complementary Meander Line Slots for a Patch Array Antenna | IEEE Antennas and Wireless Propagation Letters, 1667-1670 | Seahee Hwangbo, Hae Yong Yang, and Yong-Kyu Yoon | February 2017 | Link |
| Annealing Behavior of Ferroelectric Si-doped HfO2 Thin Films | Thin Solid Films, 615, 139-144 | Patrick D. Lomenzo, Qanit Takmeel, Saeed Moghaddam, and Toshikazu Nishida | July 2016 | Link |
| Electrophoretic Deposition of Nickel Zinc Ferrite Nanoparticles into Microstructured Patterns | AIP Advances, 6, 056105 | Stefan J. Kelly, Xiao Wen, David P. Arnold, and Jennifer S. Andrew | February 2016 | Link |
| Mixed Al and Si Doping in Ferroelectric HfO2 Thin Films | Applied Physics Letters, 107, 242903 | Patrick D. Lomenzo, Qanit Takmeel, Chuanzhen Zhou, Ching-Chang Chung, Saeed Moghaddam, Jacob L. Jones, and Toshikazu Nishida | November 2015 | Link |
Conferences
| Title | Conference | Author(s) | Date | Link |
|---|---|---|---|---|
| Substrate Bias Effect on Dynamic Characteristics of Monolithic Integration GaN Half-Bridge | 2020 IEEE International Reliability Physics Symposium (IRPS) | Weng Yang, Jiann-Shiun Yuan, and Balakrishnan Krishnan | May 2020 | Link |
| ESD Robustness of GaN-on-Si Power Devices by means of TLP/VFTLP Tests | 2020 IEEE International Reliability Physics Symposium (IRPS) | Wen Yang, Nicholas Stoll, and Jiann-Shiun Yuan | April 2020 | Link |
| A high-performance electrodynamic micro-receiver for low-frequency wireless power transfer | Proc. 33rd IEEE Intl. Conf. Micro Electro Mechanical Systems (MEMS 2020) | Miah A. Halim, Spencer E. Smith, Joseph M. Samman, and David P. Arnold | January 2020 | Link |
| Piezoceramic electrodynamic wireless power receiver using torsion mode meandering suspension | 2019 19th International Conference on Micro and Nanotechnology for Power Generation and Energy Conversion Applications (PowerMEMS) | Miah A. Halim, Spencer E. Smith, Joseph M. Samman, and David P. Arnold | December 2019 | Link |
| Experimental Evaluation of Time-Dependent Dielectric Breakdown for GaN MIS HEMTs under Various Substrate Biases | 2019 IEEE 7th Workshop on Wide Bandgap Power Devices and Applications (WiPDA) | Wen Yang, Jiann-Shiun Yuan, Balakrishnan Krishnan, and Patrick Shea | October 2019 | Link |
| ESD Behavior of GaN-on-Si power devices under TLP/VFTLP measurements | 2019 IEEE 7th Workshop on Wide Bandgap Power Devices and Applications (WiPDA) | Wen Yang, Nicholas Stoll, Jiann-Shiun Yuan, and Balakrishnan Krishnan | October 2019 | Link |
| Switching Loss Characterization of GaN-based Buck Converter under Different Substrate Biases | 2019 IEEE 7th Workshop on Wide Bandgap Power Devices and Applications (WiPDA) | Md Safayatullah, Wen Yang, Jiann-Shiun Yuan, and Balakrishnan Krishnan | October 2019 | Link |
| Effect of Mechanical Cycling on the Magnetic Properties of Permalloy Films Electroplated on Stretchable Substrates | IEEE International Flexible Electronics Technology Conference | Connor S. Smith, Kartik Sondhi, Z. Hugh Fan, Toshikazu Nishida, and David P. Arnold | August 2019 | Link |
| Experimental Verification of Substrate Bias Effect on the Gate Charge for GaN HEMTs | International Symposium on Compound Semiconductor | Weng Yang and Jiann-Shiun Yuan | May 2019 | Link |
| Low-Side GaN Power Device Dynamic Ron Characteristics under different Substrate Biases | International Reliability Physics Symposium | Weng Yang, Jiann-Shiun Yuan, Balakrishnan Krishnan, and Patrick Shea | March 2019 | Link |
| Metal oxide Semiconductor-Carbon Nanomaterial Network As a Flexible Chemical Sensor For Volatile Organic Compound Detection | IEEE SAS | Pawan Pathak, Sanghoon Park and, Hyoung J. Cho | March 2019 | Link |
| A simple passive 390 mV ac/dc rectifier for energy harvesting applications | PowerMEMS 2018 | Alex Santiago Rodriguez, Nicolas Garraud, Daniel Alabi, Alexandra Garraud, and David P. Arnold | December 2018 | Link |
| Reliability of Passive Printed Dipole Antennas Under Extreme Environments | IEEE Wireless for Space and Extreme Environments | Jacob Amontree, Kartik Sondhi, Seahee Hwangbo, Sai Guruva Reddy Avuthu, Yong-Kyu Yoon, Toshikazu Nishida, and Z. Hugh Fan | December 2018 | Link |
| Reservoir Computing based Neural Image Filters | IEEE IECON 2018 | Samiran Ganguly, Yunfei Gu, Yunkun Xie, Nibir K. Dhar, Mircea R. Stan, and Avik W. Ghosh | October 2018 | Link |
| Airbrushed Dipole RF Strain Sensor Antenna on a Stretchable Polyurethane Substrate | IEEE Sensors | Kartik Sondhi, Jacob Amontree, Seahee Hwangbo, Sai Guruva Reddy Avuthu, Yong-Kyu Yoon, Z. Hugh Fan, Toshikazu Nishida | October 2018 | Link |
| C-V Measurement under Different Frequencies and Pulse-mode Voltage Stress to Reveal Shallow and Deep Trap Effects of GaN HEMTs | Workshop on Wide Bandgap Power Devices and Applications | Wen Yang, Jiann-Shiun Yuan, Balakrishnan Krishnan, A.J. Tzou, and Wen-Kuan Yeh | October 2018 | Link |
| Arrays of Janus-Type Magnetoelectric Nanowires for Passive Magnetic Field Sensing | 18th IEEE International Conference on Nanotechnology (IEEE NANO 2018) | Matthew Bauer, David P. Arnold, and Jennifer Andrew | July 2018 | Link |
| Microfabricated Electrodynamic Wireless Power Receiver for Bio-implants and Wearables | Solid-State Sensors, Actuators and Microsystems Workshop (Hilton Head 2018 Workshop) | Nicolas Garraud, Daniel Alabi, John D. Varela, David P. Arnold, and Alexandra Garraud | June 2018 | Link |
| Hardware based Spatio-Temporal Neural Processing Backend for Imaging Sensors: Towards a Smart Camera | SPIE DCS Image Sensing Technologies: Materials, Devices, Systems, and Applications V | Samiran Ganguly, Yunfei Gu, Mircea R. Stan, and Avik W. Ghosh | April 2018 | Link |
| Development and Calibration of a Fully Differential Two-Dimensional Wall Shear Stress Sensor for Wind Tunnel Applications | AIAA SciTech Forum | Brett Freidkes, David Mills, Casey Keane, and Mark Sheplak | January 2019 | Link |
| Extending the range of wireless power transmission for bio-implants and wearables | 17th International Conference on Micro and Nanotechnology for Power Generation and Energy Conversion Applications (PowerMEMS 2017) | Nicolas Garraud, Daniel Alabi, Stasiu Chyczewski, John Varela, David P. Arnold, and Alexandra Garraud | November 2017 | Link |
| Optimization of an Enhancement-Mode AlGaN/GaN/AlGaN DHFET towards a High Breakdown Voltage and Low Figure of Merit | IEEE Workshop on Wide Bandgap Power Devices and Applications (WiPDA 2017) | Andrew Binder and Jiann-Shiun Yuan | October 2018 | Link |
| ZnO Nanoparticle-based Near-Ultraviolet Sensor Fabricated by High Current Density Electrodeposition | 2016 IEEE Sensors | Xiaochen Wang, Christopher Hughes, Sanghoon Park, Xiangmeng Ma, and Hyoung Jin Cho | October 2016 | Link |
| RF Energy Harvesting using Emerging TFET Technology | International Conference on Solid-State and Integrated Circuit Technology | Ekavut Kritchanchai and Jiann-Shiun Yuan | October 2016 | Link |
| A flush-mount sensor package for a MEMS piezoelectric microphone with through-silicon-vias for aircraft fuselage arrays | 2016 Hilton Head Workshop | Tiffany Reagan, James R. Underbrink, Jessica Meloy, and Mark Sheplak | June 2016 | Link |
Research Capabilities
| Image | First Name | Last Name | Site | Research Topics | Google Scholar |
|---|---|---|---|---|---|
 | Reza | Abdolvand | University of Central Florida | Functional Materials (Piezoelectrics); Phononic Devices | Link |
 | Jennifer | Andrew | University of Florida | Functional Materials (Ferroelectrics, Piezoelectrics, Multiferroics); Nanomaterial Synthesis; Directed Assembly of Nanomaterials; Biosensors | Link |
 | David | Arnold | University of Florida | Functional Materials (Magnetics, Multiferroics); Directed Assembly of Nanomaterials; MEMS/NEMS; Physical Sensors (Magnetic); Power Electronics; Wireless Power | Link |
 | Prasanna | Balachandran | University of Virginia | Machine Learning; Materials Informatics | Link |
 | Issa | Batarseh | University of Central Florida | Power Electronics | Link |
 | Andreas | Beling | University of Virginia | Optoelectronics Photonic Ics; Applications In Optic Communications; M-wave Photonics | Link |
 | Steven | Bowers | University of Virginia | Holistic Integration of High-F Analog Circuits; Advanced Digital; Integrated Si Photonic Ics; mm-Wave Systems | Link |
 | Benton | Calhoun | University of Virginia | Low-power VLSI Subthreshold Circuits | Link |
 | Joe | Campbell | University of Virginia | Avalanche Pds; Photonic Ics; Semiconductor Lasers; Waveguide Switches; Optical Modulators | Link |
 | Kenle | Chen | University of Central Florida | RF; Micro/mm-Wave Circuits; Power Amplifiers | Link |
 | Hyoung Jin "Joe" | Cho | University of Central Florida | Environmental Sensors; Directed Assembly of Nanomaterials; MEMS/NEMS; Flexible Devices | Link |
 | William | Eisenstadt | University of Florida | Mixed-Signal Design and Test; RF Circuits and Systems | Link |
 | Hugh | Fan | University of Florida | Nontraditional Substrates (Polymers, Paper); Flexible Electronics; MEMS/NEMS; Biosensors; Microfluidics; Low-Power Logic/Memory | Link |
 | Avik | Ghosh | University of Virginia | Material and Transport Modeling; 2D Materials; Correlated Systems; Nanomagnetics; Thermal Modeling; Low-power Switching | Link |
 | Xun | Gong | University of Central Florida | Antennas; RF MEMS | Link |
 | Jing | Guo | University of Florida | Low-Power Logic/Memory (2D Nanodevices, Ferroelectric Devices); Device Simulation and Modeling | Link |
 | Patrick | Hopkins | University of Virginia | Energy Transport; Charge Flow; Soft Materials; Liquids, Vapors and Interfaces | Link |
 | Jon | Ihlefeld | University of Virginia | Material Integration; Ferroelectrics; Dielectrics; Ion Conducting Thin Films | Link |
 | Tengfei | Jiang | University of Central Florida | Advanced Packaging; Through Si/Glass/Sapphire Vias; Harsh Environment Sensors | Link |
 | Jack | Judy | University of Florida | MEMS/NEMS; Neural Interfaces | Link |
 | Aravinda | Kar | University of Central Florida | Laser Machining; Antennas; Phononic Devices | |
 | Sanjeev | Koppal | University of Florida | Imaging | Link |
 | Mark | Law | University of Florida | Wide-Bandgap Semiconductor Devices; Device Simulation and Modeling | Link |
 | Arthur | Lichtenberger | University of Virginia | Superconducting Circuits For mm Wave/Heterodyne Receivers | |
 | Jiwei | Lu | University of Virginia | Strong Correlated Oxides; Nano Magnetism; Multiferroic Thin Films | Link |
 | Nima | Maghari | University of Florida | Mixed-Signal Design and Test; Low-Power Data Converters | Link |
 | Stephen | McDonnell | University of Virginia | Growth and Characterization of 2D Models | Link |
 | Saeed | Moghaddam | University of Florida | Atomic Layer Deposition; MEMS/NEMS; Energy Storage; Microheat Exchange | Link |
 | Toshikazu | Nishida | University of Florida | Functional Materials (Ferroelectrics, Piezoelectrics); Atomic Layer Deposition; Flexible Electronics; MEMS/NEMS; Microfluidics; Neural Interfaces; Low-Power Logic/Memory (Ferroelectric Devices); Wide-Bandgap Semiconductor Devices; Energy Storage | Link |
 | Pamela | Norris | University of Virginia | Fs Laser Studies of Material Properties; Aerogels | Link |
 | Erin | Patrick | University of Florida | Neural Interfaces; Device Simulation and Modeling | Link |
 | Stephen | Pearton | University of Florida | GaN Devices and Sensors | Link |
 | Olivier | Pfister | University of Virginia | Quantum Information | Link |
 | Seetha | Raghavan | University of Central Florida | Functional Materials; Physical Sensors; Harsh Environment Sensors | Link |
 | Swaminathan | Rajaraman | University of Central Florida | Flexible Electronics; MEMS/NEMS; Biomedical devices | Link |
 | Petra | Reinke | University of Virginia | Surface and Interface Science | Link |
 | Fan | Ren | University of Florida | Chemical Sensors (GaN); Wide-Bandgap Semiconductor Devices | Link |
 | Mark | Sheplak | University of Florida | Nontraditional Substrates (Sapphire); Laser Machining; Advanced packaging; Through Si/Glass/Sapphire Vias; MEMS/NEMS; Physical Sensors (Acoustic, Flow); Harsh Environment Sensors; Energy Harvesting | Link |
 | Nikhil | Shukla | University of Virginia | Solid State Development For Boolean/NB Computing; Large Scale Data Storage; Material Integration For Diverse Fns | Link |
 | Mircea | Stan | University of Virginia | Circuits and Architecture; Spin Torque; Stos | Link |
 | Kalpathy | Sundaram | University of Central Florida | Functional Materials (Oxides) | |
 | Roozbeh | Tabrizian | University of Florida | MEMS/NEMS; Imaging; Phononic Devices; RF MEMS | Link |
 | Robert | Weikle | University of Virginia | mm and Sub-mm Electronics; High Frequency Devices; IC Antennas | Link |
 | Huikai | Xie | University of Florida | Nanomaterial Integration; MEMS/NEMS; Physical Sensors (Inertial); Micro Optical Systems; Imaging; Photonic Devices; Power Electronics | Link |
 | Xu | Yi | University of Virginia | Microwave Photonics; Optical Frequency Combs | Link |
 | Yong-Kyu "YK" | Yoon | University of Florida | Nontraditional Substrates (Glass); Interposers; Through Si/Glass/Sapphire Vias; MEMS/NEMS; Neural Interfaces; Antennas; Metamaterials; RF MEMS; RF Circuits and Systems; Wireless Power | Link |
 | Jiann-Shuin "Peter" | Yuan | University of Central Florida | Flexible Electronics; Neural Interfaces; Wide-Bandgap Semiconductor Devices; Device Simulation and Modeling; RF Circuits and Systems; Power Semiconductor Devices; Power Electronics; Energy Harvesting; Wireless Power | Link |
 | Mona | Zebarjadi | University of Virginia | Energy Conversion; Thermoelectrics | Link |
 | Lei | Zhai | University of Central Florida | Nontraditional Substrates (Polymers) | Link |